To help PCBs and other physically connected components survive vibration, board bending, thermal mismatching, and stress during thermal cycling, Knowles Precision Devices has launched a range of leaded standoff components, Metal Frame J-Lead Terminal MLCCs, that are qualified to AEC-Q200. AEC-Q200 is the global standard for stress resistance in passive electronic components in automotive applications.
Our Metal Frame J-Lead Terminal MLCC components offer enhanced performance under critical testing conditions, including thermal shock and mechanical vibrations. These high-reliability parts are capable of 3,000 thermal cycles with no degradation of interconnects when mounted on an FR4 board. Compared to a surface-mounted chip, lead flexibility accommodates much more board bending and flexing before internal cracks form.
In arrangements with many components clustered on a board, leaded standoffs are advantageous because they position ceramic elements off the board, ultimately providing more design flexibility. With high voltage ratings, standoffs can help control flashover across the component surface as well.
Our selection features:
Today, you can find leaded options on our MLCC data sheet and AEC-Q200 family data sheet. Contact us if you need additional information.