Streamlining PCB Design with Crossovers for High-Frequency Applications

Posted by Peter Matthews on Oct 23, 2024 8:15:00 AM
Peter Matthews

Considering the complexities of routing and signal integrity, it’s more and more common to see multilayer printed circuit board (PCB) designs where radio frequencies (RF) or digital traces cross on different layers of the stack. However, depending on the number of crossovers needed, the cost and complexity of this solution can outweigh the potential design benefits. For example, at high frequencies, multilayer designs are uniquely expensive to build; when laying out a ‘tile’ phased array, there’s very little space for components because of the λ/2 pitch of the array.  

Streamlining PCB  Design with Crossovers  for High-Frequency Applications

Surface-mount crossovers are an alternative solution that allows a design to exist in one single layer. That said, most crossovers on the marketplace are below 6 GHz and less than ideal for high-frequency applications.  

Knowles Precision Devices recently developed a broadband crossover device, Figure 1, that operates from DC to 40 GHz to better serve applications that operate in the X, Ku, K and KA bands. This includes advanced RF, high-speed communications and radar technologies.

With a small form factor, our high-performance crossovers save on layer count and cost by simplifying PCB signal routing and construction. In aggregate, these improvements mitigate voltage standing wave ratio (VSWR) issues from shifting around the board. The result is higher throughput in communication applications and finer resolution in radar applications. 

Figure-1-high-freq-crossover

Figure 1: High-frequency RF crossover device construction with dimensions of L 0.15” x W 0.10” x H 0.02” 

For additional information, review our High Frequency RF Crossover datasheet or, to request samples, contact DLIengineering@knowles.com.

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