At Knowles Precision Devices, we have more than 40 years of experience developing high-performance, high-reliability components for military applications. Our US-based manufacturing facilities adhere to the highest military-grade quality and reliability standards so our components can be used in sophisticated, secure military and aerospace systems.

Magnetic resonance imaging (MRI) is a powerful diagnostic tool for generating detailed images of the body using advanced physics and engineering. Here, we’ll cover the interplay between the two fields and the RF innovations driving MRI advancements. 

Energy storage capacitor banks supply pulsed power in all manner of high-current applications, including shockless compression and fusion. As the technology behind capacitor banks advances with more precise switching and higher energy density, fast discharge capacitors can reliably support more advanced applications.  

With more and more mission-critical systems relying on electrical power, consistent and reliable backup power is essential to ensure uninterrupted operation. Facilities like data centers and hospitals leverage backup power to manage the short, but potentially catastrophic, delay between grid power failure and the start of long-term back up (e.g., local generation via diesel generators).  

Electronic warfare (EW) systems are an increasingly critical component of modern warfare. They seek to control and exploit the electromagnetic spectrum to gain an advantage over adversaries while preventing them from reciprocating. This includes detecting and denying the use of radar systems and GPS. There are three main sectors within electronic warfare. Electronic attack (EA) focuses on acts designed to disrupt, degrade, destroy or deceive. Electronic protection (EP) seeks to diminish the effectiveness of adversarial EA systems. Electronic support (ES) extracts signal information for intelligence purposes.

As a manufacturer of custom ceramics for thin-film circuit development for more than four decades, we are highly familiar with all the complexities involved in working with these materials to build a variety of circuits. Over the years, we’ve received quite a few questions about this technology, so we put together this Q&A to help answer some of the common questions you may have about thin film circuits. 

In complex radio frequency (RF) applications, “wideband” has varying definitions depending on both the application of interest and the portion of the RF circuit you’re focused on. Wideband can be used to describe the entire spectrum shown in Figure 1 or large portions of it.   

In a short period of time, artificial intelligence (AI) large language models (LLMs) like ChatGTP and Claude have made leaps and bounds in terms of their size and sophistication. Size, as measured by the number of parameters, has increased by a factor of one thousand in merely five years, and it’s not projected to stop (Figure 1). This rapid growth raises numerous questions about the future of AI, while also presenting immediate challenges, with power consumption being a significant concern.  

Companies across the world are engaged in fusion research; some are large national and international labs while others are start-ups looking for lower-cost alternatives to traditional fusion techniques. Their work is built on the premise that fused light nuclei have a net positive energy yield because their combined mass is less than the sum of their individual masses before fusion. Think Albert Einstein’s E = mc². 

Considering the complexities of routing and signal integrity, it’s more and more common to see multilayer printed circuit board (PCB) designs where radio frequencies (RF) or digital traces cross on different layers of the stack. However, depending on the number of crossovers needed, the cost and complexity of this solution can outweigh the potential design benefits. For example, at high frequencies, multilayer designs are uniquely expensive to build; when laying out a ‘tile’ phased array, there’s very little space for components because of the λ/2 pitch of the array.