Since a lot of electronic component manufacturers are now focusing production efforts on high-volume commodity applications, as their specialty component production equipment ages, many companies are electing to divest in this type of production. One component that we’ve seen fall into this category in recent years is the surface-mount electromagnetic interference (EMI) filter. These three-terminal chips use conventional multilayer ceramic capacitor (MLCC) manufacturing techniques to form a filter that has a short circuit end-to-end and has a capacitance between the end terminals and the side (ground) terminals. 

To help customers with filter selection, we generally provide a lot of information on what our filters can do. But in this new Filter Basics Series, we are taking a step back to cover some background information on how filters do what they do. Regardless of the technology behind the filter, there are several key concepts that all filters share that we will dive into throughout this series. By providing this detailed fundamental filter information, we hope to help you simplify your future filtering decisions.

In part 4 of this series, we provide overviews of the main filter types and key filter technologies available today.

RF circuits for applications in the mmWave range (30 to 300 GHz) require high-performance filtering to meet the high-data, high-speed functionality that operating at these higher frequencies promises. However, filters for devices operating in the mmWave range will not function optimally if your printed circuit board (PCB) is not configured appropriately. For this reason, RF design engineers need to make a number of critical PCB design decisions that range from selecting the right materials to developing a board configuration that will limit common issues such as spurious-wave-mode propagation, conductor and radiation losses, unwanted resonance, and dispersion.

To help customers with filter selection, we generally provide a lot of information on what our filters can do. But in this new Filter Basics Series, we are taking a step back to cover some background information on how filters do what they do. Regardless of the technology behind the filter, there are several key concepts that all filters share that we will dive into throughout this series. By providing this detailed fundamental filter information, we hope to help you simplify your future filtering decisions. 

To kick-off this series, our first post breaks down the basic properties impacting capacitor and inductor performance including resistance, capacitance, inductance, and impedance.

At this point, you’ve likely seen a slew of mainstream news articles about 5G causing safety concerns around air travel. In fact, ahead of the rollout of new 5G services from major US telecom companies including Verizon and AT&T on Jan. 19, 2022, many international airlines canceled or delayed flights to major US airports where they believed 5G signals could possibly interfere with the radar signals required to properly operate landing equipment on their planes.

In recent years, the focus for satellite communication (SATCOM) applications has shifted from coverage to capacity. As a result, SATCOM devices are being pushed to operate at higher bandwidths in the Ka, V, and E bands. At the same time, these devices need to be made increasingly smaller, which means smallsats, or satellites weighing less than 500 kg, are quickly gaining momentum, making size, weight, and power (SWaP) critical design considerations as well.

Many critical military operations around the world are increasingly relying on a variety of electronic warfare devices for a range of threat suppression, detection, and neutralization activities. This means that numerous devices operating across the RF spectrum including low-frequency devices in the VHF band and mmWave devices in the Ka band are necessary. As shown in Figure 1, when many electronic warfare devices are in use, a large number of signals are being sent and received and crossing paths. Therefore, it’s easy for any one of these devices to experience issues with interference if proper filtering techniques are not in place.

During the first-ever virtual Menlo Micro Switch Summit, Knowles Precision Devices joined John Richardson, founder and president of X-Microwave, and Tom Clickenbeard, applications engineer at Menlo Microsystems, to give a presentation on Prototyping Using X-Microwave’s XM-Blocks with Knowles Precision Devices RF Filters and MEMS Switches.

As early adopters of beamforming technology in the 1960s, aerospace and defense organizations have a lot of experience using the initial large-scale active electronically scanned arrays (AESAs) for military radar tracking applications. But these arrays aren’t as convenient for some applications today as the operational frequencies of the targets of interest for many military applications are increasing. This means the wavelengths of the signals that need to be monitored are getting shorter and these radar applications need denser arrays since antenna spacing needs to be set at one half the wavelength. For example, at 25GHz, the wavelength in free space is approximately 12mm (0.47”), leading to half-wave spacing for antennas of 6mm (0.24”). Also, as arrays become denser, the new challenge for RF system designers is avoiding interference in these tighter spaces, especially when transmitting signals.

Today, electronic warfare applications need to detect a wide variety of signals ranging from UHF communications to GPS and other data signals in the L band to high-frequency radar signals that can fall in the X, S, or K bands. Therefore, these receivers need to operate across an extremely wide range of bandwidths to pick up and understand signals anywhere from 300MHz to 20GHz and beyond. However, a basic general wideband antenna isn’t sufficient for these applications because selectivity is needed to determine what you are actually listening to. Additionally, as if the task of designing an ultra-wideband receiver with selectivity wasn’t challenging enough, RF designers are simultaneously facing pressure to reduce the size, weight, and power (SWaP) of these applications as well.