Heterogeneous integration (HI) refers to the process of combining a set of electronic components with different functions and material compositions into a single, compact system. Particularly in radio frequency (RF) and microwave applications, HI-based designs accommodate higher functional density and better performance when implemented with application-specific requirements in mind. Integrated Passive Devices (IPDs), like conductors, resistors, vias, traces, and bridges, play a significant role in HI because they’re largely responsible for the resulting performance optimization when components combine.
The Role of HI and IPDs in Electronics Design
IPDs in HI-based designs present a world of possibilities when it comes to performance and manufacturing optimization. Here’s what you can expect:
Improved Performance
Integrating different materials and technologies results in performance gains. For example, semiconductor materials like Gallium Arsenide (GaAs), Gallium Nitride (GaN), and Silicon (Si) maximize efficiency and power output when combined in amplifiers, mixers, and oscillators. This combination is uniquely suitable for applications like radar, satellite communications, and 5G networks.
IPDs in HI-based designs offer better electrical performance than their discrete counterparts. With lower parasitic effects, tighter tolerances, and more consistent temperature stability, IPDs improve signal integrity, reduce signal loss, and improve overall integrated system performance. Further, some IPDs are specifically designed to improve EMI performance in densely packed electronics to meet or exceed regulatory requirements.
Higher Functional Density
With multiple functions in a single system, naturally, functional density increases. This can reduce system size and weight, which is essential for mobile devices, wearables, aerospace systems, and other applications where size is highly constrained. In addition, a mix of digital, analog, and mixed-signal components enhances system performance by enabling more complex systems.
Lower Cost
Reducing the number of separate components, package complexity, and assembly steps can reduce overall costs. Further, integrating components can simplify the overall design process and reduce the bill of materials (BOM). With IPDs, designers also have the benefit of simpler manufacturing, which translates to faster time-to-market, higher yields, and reductions in production costs.
High Reliability
Reducing the number of interconnects and solder joints improves the reliability of RF and microwave systems by limiting sources of failure. The use of IPDs also reduces the number of discrete components. From a materials perspective, IPDs can be designed with more robust materials, which improves their durability and long-term reliability.
Enhanced Thermal Management
By integrating heat-dissipating materials and structures, thermal management systems in HI-based designs are more efficient at removing heat.
Design Flexibility
HI is useful for custom, application-specific designs. With the right mix of IPDs, engineers can fulfill a wide range of industry-specific requirements.
Interposers in Heterogeneous Integrations
Along with IPDs, thin film interposers play an important role in enabling advanced forms of packaging, including HI. The electrical and manufacturing properties of these building blocks are particularly advantageous in RF and microwave applications because of the performance and efficiency gains they offer.
Careful consideration for all application-specific requirements, material choices, and manufacturing processes ensures optimal performance and desired reliability in the end product. For more information on thin film interposer design and Knowles Precision Devices’ build-to-print services, see our Build-to-Print Best Practices Guide and our in-depth Build-to-Print Basics ebook.
