A deep brain stimulator (DBS), also known as a neuro-stimulator, is a medical device that uses electrical stimulation to treat neurological disorders such as Parkinson's disease, essential tremor, dystonia, and obsessive-compulsive disorder (OCD). The DBS is typically implanted under the skin near the collarbone or in the abdomen, and connected to a thin wire, or lead, that runs under the skin to the targeted area of the brain as shown in Figure 1. 

Heterogeneous integration (HI) refers to the process of combining a set of electronic components with different functions and material compositions into a single, compact system. Particularly in radio frequency (RF) and microwave applications, HI-based designs accommodate higher functional density and better performance when implemented with application-specific requirements in mind. Integrated Passive Devices (IPDs), like conductors, resistors, vias, traces, and bridges, play a significant role in HI because they’re largely responsible for the resulting performance optimization when components combine.

One of the things all technical disciplines excel at is creating terminology that can trip up those who are not accustomed to speaking the language every day. Take the title of this article for example. These three words sound similar and are definitely inter-related, but they are not inter-changeable.

Innovation in advanced packaging was driven, in part, by advancements in interposer design and construction. Interposers are electronic components designed to sit within a package and connect different circuits and components via interconnects. Thin film interconnects are standard in high-frequency components and subsystems where transmission line widths are small (i.e., .005” and under) to improve overall system performance. They also support high-power applications where thermal conductivity is more of a concern and certain materials like beryllium oxide and aluminum nitride are more commonly used. 

Electronic devices power our world and allow us to communicate. In all applications requiring signal integrity and accurate power amplification, blocking capacitors are used to provide clean waveforms and correctly amplified voltages.

Electronic devices provide the tools we need to power the world. From cell phones to modern vehicles to scientific equipment to the appliances in our homes, we rely on electronics to improve and even lengthen our lives. All electronics depend on clean power, and the bypass capacitor is crucial in ensuring devices safely meet their power specifications.

Resistors, inductors, and capacitors are the most common passive electronic components; they’ve long been available at different price points with different capabilities. Heightening expectations for performance in today’s advanced electronics environment mean we need equally advanced processes for creating components.

To protect people and critical equipment, military-grade electronic devices must be designed to function reliably while operating in incredibly harsh environments. Therefore, instead of continuing to use traditional silicon semiconductors, in recent years, electronic device designers have started to use wide band-gap (WBG) materials such as silicon carbide (SiC) to develop the semiconductors required for military device power supplies. In general, WBG materials can operate at much higher voltages, have better thermal characteristics, and can perform switching at much higher frequencies. Therefore, SiC-based semiconductors provide superior performance compared to silicon, including higher power efficiency, higher switching frequency, and higher temperature resistance as shown in Figure 1.

From industrial to automotive to aerospace applications, power electronics are demanding higher capacitance in smaller packages. Therefore, to meet both capacitance demands and size requirements, electronic designers simply cannot continue to add more capacitors. While capacitor stacking is an option, many stacked assemblies are still quite large and stacking often introduces new failure modes, such as piezo electric cracking (Figure 1). 

As the name implies, “thin film” is a precisely deposited layer of material used to fabricate electronic components. “Thin” can mean as little as a fraction of a nanometer thick. Circuits constructed with thin film are used in a wide range of electrical and optical applications, but they are most advantageous when high-frequency performance, tight tolerances, thermal conductivity, and long-term reliability are paramount concerns. Particularly in the high-frequency microwave space, small size, line definition, and repeatable construction offer significant performance benefits.