Today, one of the most cost-effective and flexible electrical interconnection techniques available is wire bonding. With this technique, thin wire and a combination of heat, pressure, and/or ultrasonic energy are used to create a connection between an integrated circuit or other semiconductor devices and device packaging.
With the challenges of today’s global supply chain, we understand that improving the efficiency of your development process is critical to delivering quality products on time. When evaluating components for use in your product, you don’t have time to wait 2–3 weeks for a product sample. And you certainly don’t have the time to wait another 2–3 weeks if you discover that the sample you ordered isn’t right for your design. That’s why Knowles Precision Devices is now offering all-in-one Single Layer Capacitor (SLC) Design Kits for design engineers.