To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 11 covers how we work with solder, solder masks, and supported bridges in the thin-film components we design and develop.

You can have a beautifully designed circuit, but if you can’t reliably connect the various components within the circuit, your beautiful design is negated. Let’s look at some of the materials and techniques Knowles Precision Devices uses for soldering and bridging, and how we handle these techniques as circuit complexity increases.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 10 covers our key design parameters for resistors as well as our standard layouts.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 9 covers the various strategies that can be used for adding vias into circuits.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 8 provides basic and multilayer conductor guidelines as well as information on fine line conductor features.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 7 covers how we use in-house laser machining, laser trimming, and other laser cutting techniques to build high-precision thin-film components.