From military aircraft to electronic warfare defense systems, aerospace and defense applications are placing new demands on their power electronics. Defense electronics systems must function reliably for their lifetime while operating at higher voltages and wider temperature ranges, and all while becoming smaller, lighter, and consuming less power.

As demand for high-efficiency and high-power-density inverters continues to grow, the so-called “flying” capacitor multilevel inverter is emerging as a strong choice for many power electronics systems. Since these capacitors can “float” to different electric potentials depending on the connected semiconductor switching structure and state, they help balance out voltage level differences due to manufacturing tolerances, temperature variations, and other factors. These capacitors are also helpful in balancing voltage across the structure by temporarily storing and releasing energy as needed, increasing power density and quality, and optimizing the use of existing voltage availability.

When constructing multilayer ceramic capacitors (MLCCs), there are two classes of dielectrics electrical engineers typically select from depending on the application – Class 1, which consists of non-ferroelectric materials such as C0G/NP0, and Class 2, which are ferroelectric materials such as X5R and X7R. One key difference between these materials comes in the form of capacitance stability as voltage and temperature increase. With Class 1 dielectrics, capacitance will remain stable when DC voltage is applied and operational temperature increases. On the other hand, Class 2 dielectrics, which have a higher dielectric constant (K), are less stable with regards to temperature, voltage, frequency, and time.

Standards are a form of technical infrastructure, and their influence is felt throughout the electronics industry. For example, formed in 1924, the Electronic Industries Alliance (EIA) was an American standards organization that established an alliance of trade associations in the United States electronics manufacturing industry. Their collaboration ensured that electronic equipment produced by different manufacturers was compatible and interchangeable. The EIA formally dissolved in February 2011, dividing by sector.

Product designers working on critical applications requiring electrical power must carefully select components that not only supply the appropriate amount of voltage at the right time, but also help mitigate issues such as voltage ripple, ensure system longevity, and improve component reliability. 

The generation of RF energy is critical for a wide range of technologies including magnetic resonance imaging (MRI), semiconductor manufacturing, industrial lasers, and wireless charging systems that require high-frequency current and minimal instances of power loss. For example, with an industrial laser, the RF plasma excitation, which is when electrons are broken off an atomic bond and plasma forms, requires RF sources ranging from 1kHz to 40.68MHz depending on the energy required, and a CO₂ laser RF power supply that contains a standard source at 13.56MHz, 81MHz, or 125MHz.

Designing medical implantable devices for high reliability is crucial for a variety of reasons. First, given the life-critical functions performed by many medial implantable devices, and the invasive procedure required to implant medical equipment properly in the human body, it is imperative that all medical devices are designed to function reliably throughout their entire lifetime. Furthermore, since patient safety is paramount, any precautions to reduce the possibility of potentially life-threatening malfunctions, recalls, and replacement surgeries are necessary. And, beyond preventing patient safety issues, there may also be severe economic and legal implications for device manufacturers if an implantable device fails.

Today, one of the most cost-effective and flexible electrical interconnection techniques available is wire bonding. With this technique, thin wire and a combination of heat, pressure, and/or ultrasonic energy are used to create a connection between an integrated circuit or other semiconductor devices and device packaging.

Trimmer capacitors are variable components used to calibrate RF circuits during manufacturing or servicing. These components allow for variable tuning--think oscillator frequency values or rise and fall times. Should values drift over the life of the device, trimmer capacitors can be recalibrated as needed. For sensitive applications like magnetic resonance imaging (MRI), these components help to optimize performance where any instability in time or temperature could impact the image output.

Today, millions of people around the world rely on pacemakers to help regulate their heart’s rhythm. A traditional pacemaker usually consists of a pulse generator that is about the size of a tea bag and implanted under the skin near the collarbone, and a wire, or lead, that runs through a blood vessel to the heart. The end of the lead has an electrode on it that touches the heart wall to deliver electrical impulses. However, in the last decade, innovations in pacemaker technology have led to the introduction of a new style of pacemaker, known as the leadless pacemaker, that is about 1/10th the size of a traditional pacemaker, or about the size of a vitamin (Figure 1).