At Knowles Precision Devices, we purposely avoid commodity components. What we thrive on is doing the hard things. We handle the specialty components that go in systems that cannot fail and that operate at extremely high voltages, temperatures, or frequencies. Do you have a complex technical challenge with hard-to-meet performance, size, or other requirements? Bring it to us. It’s what we do.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 2 provides details on our custom thin-film process for complex designs.

Planning is in the works for Fifth Generation (5G) communication systems that will enable a hundred-fold increase in user data-rates – and with this increase comes a need for significant increases in bandwidth over what is currently available. Why does bandwidth follow when we ask for an increase in data rates? 

At Knowles Precision Devices, we are not trying to be your typical commodity component manufacturer. We want to do things that are hard and help customers solve their most difficult engineering challenges. This is why we offer build-to-print services to facilitate thin-film product design, manufacturing and testing from prototype to high-volume production.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 1 starts by providing a brief overview of how we approach build-to-print and what thin-film technology actually is.

Many circuits in broadband applications require the coupling of RF signals, which can be a complicated process since it involves removing the DC component to allow only the high-frequency AC component to pass or bypass. Removing the AC component from a DC line is done by placing a coupling capacitor in series with the path the signal takes.

The Wilkinson Power Divider, designed by Ernest Wilkinson in the 1960s, uses quarter wave transformers to split an input signal into two equal phase output signals. Since the design is reciprocal, Wilkinson Power Dividers can also be used as a power combiner. With this flexibility, they are widely used in many RF and microwave communication systems, including those with multiple channels or complex feed networks.

To meet consumer demand for longer driving ranges and faster charging, electric vehicle (EV) manufacturers are redesigning vehicles to move from 400V to 800V battery systems. As a result of using higher operating voltages, EV designers and original equipment manufacturers (OEMs) need components, such as multi-layer ceramic capacitors (MLCCs), that can withstand voltages well beyond those expected under normal operating conditions. For example, a drivetrain running off an 800V battery system may be subjected to a withstand test of up to 4kV DC for 60 seconds, which is a standard safety test in high voltage systems.

As 5G innovation forges on, radio systems continue to emerge. Each system has a range of requirements, including specific RF filter performance needs, and it’s up to the 5G FR2 Ecosystem of suppliers to meet that demand. In response, Knowles Precision Devices (KPD) supports a wide variety of 5G radio applications.

Today, the design and development of many applications, such as power electronics in electric vehicles (EVs), is driven largely by concerns about size and weight. This means the film capacitors traditionally used by electronics engineers aren’t always the best option. Instead, multi-layer ceramic capacitors (MLCCs) are emerging as an excellent alternative to film capacitors. Let’s review some of the considerations to keep in mind when you are deciding if making the switch is the right choice for your application.  

As many industries, including RF and automotive, need to incorporate more features in less space, engineers are constantly looking for ways to do more in a smaller footprint. For example, there is often demand for more multi-layer ceramic capacitors (MLCCs) to achieve higher capacitance values while at the same time increasingly limited space is available. Thus, continuing to simply add capacitors inside an application to achieve a higher capacitance value is not a viable option.