As RF and microwave systems require higher performance in a small footprint, designers and engineers need to get more out of every component, including capacitors. To meet these demands, Knowles Precision Devices has expanded its line of single-layer vertical electrode (V Series) capacitors to include the 100nF V80 Bypass Capacitor. The V80 is a revolutionary development for capacitors as it is the first SLC to feature an operating voltage of 50V in .084” x .042” package. The closest competitor product at this size is only rated for 16V.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 11 covers how we work with solder, solder masks, and supported bridges in the thin-film components we design and develop.

You can have a beautifully designed circuit, but if you can’t reliably connect the various components within the circuit, your beautiful design is negated. Let’s look at some of the materials and techniques Knowles Precision Devices uses for soldering and bridging, and how we handle these techniques as circuit complexity increases.

With our new expanded range of enhanced safety-certified multilayer ceramic capacitors (MLCCs), Knowles Precision Devices now offers a unique combination of capability and safety certification for electronic device applications. These new surface-mount MLCCs comply with international UL60384-14 and EN60384-14 specifications and can be used instead of leaded film capacitors in AC-DC power supplies where a lightning strike or other voltage transients represent a threat to the electronic equipment.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 10 covers our key design parameters for resistors as well as our standard layouts.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 9 covers the various strategies that can be used for adding vias into circuits.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 8 provides basic and multilayer conductor guidelines as well as information on fine line conductor features.

Looking back, 2020 was a year full of big changes regarding how RF spectrum is allocated in the US. Led by the Federal Communications Commission (FCC), multiple portions of the spectrum ranging from the C band to the V band were either opened to new uses and/or auctioned to new users throughout the year. These changes are driving a variety of new opportunities for wireless device manufacturers and broadband and cellular carriers, which is resulting in a range of exciting new challenges for RF technology vendors to help solve. 

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 7 covers how we use in-house laser machining, laser trimming, and other laser cutting techniques to build high-precision thin-film components.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 6 covers the various aspects of metallization that we consider to determine the best fit for our customer’s build-to-print applications.

To provide a better understanding of build-to-print in general and the breadth of our offerings, as well as how our thin-film technology can benefit your applications, we’ve put together a Build-to-Print Basics series. Part 5 provides an overview of the common and custom materials we typically use and information on how we can work together to determine the best option for your application.